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https://www.riss.kr/link?id=O37758934
2000년
eng
1550-5723
학술저널
INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS
014-017 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0930815599
International symposium on advanced packaging materials: processes, properties and interfaces
Braselton, GA
2000; Mar
0
상세조회0
다운로드
Materials and Process Technology: Materials
Development of Conductive Adhesives Filled with Low-melting-point Alloy Filters
Novel Conductive Adhesives with Stable Conductivity and High Impact Resistance
Conductive Adhesives for Solder Replacement in Electronic Packaging