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      세락믹스/금속 접합계면에서의 파괴역학적 강도평가에 대한 연구 = A study on the Fracture Mechanical Strength Evaluation in Joint Interface of Ceramics and Metal

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      https://www.riss.kr/link?id=A3081345

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      Indentation fracture method and 4-point bending test are carried out to measure the residual stresses and the bending strength, and to investigate the mechanism of fracture mechanics in the bonded interface of ceramic and metal.
      The results obtained are as follows ;
      1) The fracture patterns of bonded materials shows that the delamination fracture of interfaces is stablely developed from the interfaces of ceramic/active metallic bonded materials at. the specimen center, and the fracture is unstablely generated through a refraction on the middle ceramic.
      2) Distribution of residual stresses is quantitatively investigated on the ceramic side of banded materials.
      3) It is found that the residual stresses of interface vertical direction are concentrated on the bonded interface at the ceramic side.
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      Indentation fracture method and 4-point bending test are carried out to measure the residual stresses and the bending strength, and to investigate the mechanism of fracture mechanics in the bonded interface of ceramic and metal. The results obtained...

      Indentation fracture method and 4-point bending test are carried out to measure the residual stresses and the bending strength, and to investigate the mechanism of fracture mechanics in the bonded interface of ceramic and metal.
      The results obtained are as follows ;
      1) The fracture patterns of bonded materials shows that the delamination fracture of interfaces is stablely developed from the interfaces of ceramic/active metallic bonded materials at. the specimen center, and the fracture is unstablely generated through a refraction on the middle ceramic.
      2) Distribution of residual stresses is quantitatively investigated on the ceramic side of banded materials.
      3) It is found that the residual stresses of interface vertical direction are concentrated on the bonded interface at the ceramic side.

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