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https://www.riss.kr/link?id=O38130059
2002년
eng
1089-8190
2576-9626
학술저널
INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM
27-34 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780373014; 0780373022
International electronics manufacturing technology symposium
27th
San Jose, CA
2002; Jul
0
상세조회0
다운로드
A Novel Process for Protecting Wire Bonds from Sweep During Molding
Achieving a World Record in Ultra High Speed Wire Bonding Through Novel Technology
The Use of Pre-Molded Leadframe Cavity Package Technologies in Photonic and RF Applications
Measurement Challenges for On-Wafer RF-SOC Test