Nanostructured Biointerfacing of Metals with Carbon Nanotube/Chitosan Hybrids by Electrodeposition for Cell Stimulation and Therapeutics Delivery

다국어 초록 (Multilingual Abstract)

<P>Exploring the biological interfaces of metallic implants has been an important issue in achieving biofunctional success. Here we develop a biointerface with nanotopological features and bioactive composition, comprising a carbon nanotube (CNT) and chitosan (Chi) hybrid, via an electrophoretic deposition (EPD). The physicochemical properties, in vitro biocompatibility, and protein delivering capacity of the decorated nanohybrid layer were investigated, to address its potential usefulness as bone regenerating implants. Over a wide compositional range, the nanostructured hybrid interfaces were successfully formed with varying thicknesses, depending on the electrodeposition parameters. CNT-Chi hybrid interfaces showed a time-sequenced degradation in saline water, and a rapid induction of hydroxyapatite mineral in a simulated body fluid. The nanostructured hybrid substrates stimulated the initial adhesion events of the osteoblastic cells, including cell adhesion rate, spreading behaviors, and expression of adhesive proteins. The nanostructured hybrid interfaces significantly improved the adsorption of protein molecules, which was enabled by the surface charge interaction, and increased surface area of the nanotopology. Furthermore, the incorporated protein was released at a highly sustained rate, profiling a diffusion-controlled pattern over a couple of weeks, suggesting the possible usefulness as a protein delivery device. Collectively, the nanostructured hybrid CNT-Chi layer, implemented by an electrodeposition, is considered a biocompatible, cell-stimulating, and protein-delivering biointerface of metallic implants.</P><P><B>Graphic Abstract</B>
<IMG SRC='http://pubs.acs.org/appl/literatum/publisher/achs/journals/content/aamick/2014/aamick.2014.6.issue-22/am505759p/production/images/medium/am-2014-05759p_0008.gif'></P><P><A href='http://pubs.acs.org/doi/suppl/10.1021/am505759p'>ACS Electronic Supporting Info</A></P>