The Growth Characteristics of Microcrystalline Si Thin Film Deposited by Atmospheric Pressure Plasma-Enhanced Chemical Vapor Deposition

다국어 초록 (Multilingual Abstract)

Microcrystalline silicon thin film was grown by atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) technique with a cylindrical rotary electrode supplied with 150 MHz very-high-frequency power. The crystalline volume fraction could be controlled by changing the flow rate ratio of silane and hydrogen gas during AP-PECVD. We could also control it by regulating the substrate scanning speed. At low substrate scanning speed, the silicon film had a low crystalline volume faction and layer-by-layer structure with alternating layers of amorphous and microcrystalline Si. On the other hand, at high substrate scanning speed, silicon crystals of sizes 25 nm grew homogeneously throughout the whole film.

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