Selective copper metallization of nonconductive materials using jet-circulating electrodeposition

다국어 초록 (Multilingual Abstract)

<P><B>Abstract</B></P> <P>In this paper, a novel selective copper metallization technique that can be used on various materials, such as glass, plastic and ceramic, is proposed. The process consists of three steps: seed layer development, pattern fabrication using jet-circulating electrodeposition, and seed layer removal. A copper seed layer for electrodeposition was formed on various materials by electron beam evaporation. Jet-circulating electrodeposition was implemented to fabricate micro-metal patterns. Localizing the circulation of a jetted electrolyte through two concentric nozzles enables rapid selective electrodeposition. The geometry of the copper pattern was investigated by means of scanning electron microscopy (SEM) and a surface profiler. As a result, copper pattern in various shapes was fabricated. The usage of an outer diameter of 290μm electrode nozzle, results in a copper pattern with a width of 430μm and a height of 28μm. Parameter study of the jet-circulating electrodeposition condition to investigate the electrodeposition mode, electrolyte jetting pressure, and average current was performed to control the width, height and surface roughness of the deposited pattern.</P> <P><B>Highlights</B></P> <P> <UL> <LI> Copper pattern metallization using jet-circulating electrodeposition is proposed. </LI> <LI> Selective metal patterning can be achieved via jet-circulating electrodeposition process. </LI> <LI> Pulse-reverse electrodeposition technique should be applied for high deposition rate. </LI> <LI> Electrolyte jetting condition should be controlled during deposition process. </LI> </UL> </P>