<P>The thermomechanical reliability of chip-scale packages (CSPs) with various underfills was evaluated by measure the electrical resistance under thermal shock and four-point bending fatigue tests. The underfill containing cycloaliphatic-type e...
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https://www.riss.kr/link?id=A107597522
2009
-
SCI,SCIE,SCOPUS
학술저널
633-638(6쪽)
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
<P>The thermomechanical reliability of chip-scale packages (CSPs) with various underfills was evaluated by measure the electrical resistance under thermal shock and four-point bending fatigue tests. The underfill containing cycloaliphatic-type e...
<P>The thermomechanical reliability of chip-scale packages (CSPs) with various underfills was evaluated by measure the electrical resistance under thermal shock and four-point bending fatigue tests. The underfill containing cycloaliphatic-type epoxy resin had lower resistance than without cycloaliphatic-type epoxy resin under thermomechanical fatigue test because the cycloaliphatic-type epoxy resin was able to mechanically relax more than the other types. The lifetimes of the CSPs under thermomechanical fatigues were strongly dependent on the properties of the underfill.</P>