CMP용 리테이닝 링의 재질이 웨이퍼의 연마성능에 미치는 영향

다국어 초록 (Multilingual Abstract)

This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after polishing a wafer with a PPS retaining ring, the average profile height of the wafer was 0.098 μm less than that of the wafer polished with a PEEK retaining ring, implying that PPS retaining rings achieve a higher polishing rate. In addition, the center area of the wafer profile had less deviation and improved flatness after polishing with the PPS ring. These results indicate that a higher polishing rate and smaller profile height deviation can be achieved using retaining rings made with PPS compared to retaining rings made with PEEK. Therefore, with semiconductor circuit patterns becoming finer and wafer sizes becoming larger, the use of PPS in CMP retaining rings can obtain more stable wafer polishing results compared to that of PEEK.

목차 (Table of Contents)

• ABSTRACT
• 1. 서론
• 2. 실험방법
• 3. 실험 및 결과 고찰
• 4. 결론
• REFERENCES

참고문헌 (Reference)

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2 배재현, "산화막 CMP에서 패드 두께가 연마율과 연마 불균일도에 미치는 영향" 한국전기전자재료학회 23 (23): 358-363, 2010

3 박기원, "산화막 CMP에서 리테이닝 링의 인서트 재질이 연마정밀도에 미치는 영향" 한국기계가공학회 18 (18): 44-50, 2019

4 Suzuki, N., "Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier" 66 (66): 329-332, 2017

5 Park, J. W., "Optimal shape of retainer ring considering edge exclusion and slurry film thickness" 1-2, 2015

6 CNUS Co., LTD., "Insert ring for retainer ring structure in chemical-mechanical polishing apparatus"

7 Khannaz, A. J., "Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies" 8 : 3063-3068, 2019

8 Yerriboina, N. P., "Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation" 158 (158): H394-H400, 2011

9 Bengochea, L. V., "Effect of Retaining Ring Slot Designs, Conditioning Discs and Conditioning Schemes on the Slurry Bow Wave Width during Chemical Mechanical Planarization" 7 (7): 253-259, 2018

10 박영봉, "Effect of Contact Angle between Retaining Ring and Polishing Pad on Material Removal Uniformity in CMP Process" 한국정밀공학회 14 (14): 1513-1518, 2013

11 STRASBAUGH, "CMP retaining ring with soft retaining ring insert"