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다국어 초록 (Multilingual Abstract)

Reflow voids created by solder oxidation reduce thereliability of lap joints. In situ visualization of reflow voids inSn-3Ag-0.5Cu (SAC305) lap-shear solder joints undercyclic stressing was realized by X-ray computed tomography(CT), while the ratcheting deformation of the solder jointswas monitored by a non-contact displacement detectingsystem (NDDS). The results revealed that the shapeevolution of reflow voids in solder joints, as characterized bythe sphericity of the voids, can be divided into three stages:i.e., the initial stage with a sharp drop, a stable stage, and arapidly declining stage. A new evolution law for describingthe progress of sphericity was proposed, and was furtherintroduced into a viscoplastic constitutive model based onthe OW-AF nonlinear kinematic hardening rule. Thedamage-coupled OW-AF model yielded an accurateestimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints.

참고문헌 (Reference)

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연월일	이력구분	이력상세
	학술지등록	한글명 : Electronic Materials Letters 외국어명 : Electronic Materials Letters
2023	평가예정	해외DB학술지평가 신청대상 (해외등재 학술지 평가)
2020-01-01	평가	등재학술지 유지 (해외등재 학술지 평가)
2013-10-01	평가	등재학술지 선정 (기타)
2011-01-01	평가	등재후보학술지 유지 (기타)
2009-12-29	학회명변경	한글명 : 대한금속ㆍ재료학회 -> 대한금속·재료학회
2008-01-01	평가	SCIE 등재 (신규평가)