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https://www.riss.kr/link?id=O38122987
2002년
eng
학술저널
INTERNATIONAL CHEMICAL MECHANICAL PLANARIZATION FOR ULSI MULTILEVEL INTERCONNECTION CONFERENCE
216-224 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
International chemical-mechanical planarization for ULSI multilevel interconnection conference; (CMP-MIC)
7th
Santa Clara, CA
2002; Feb
0
상세조회0
다운로드
Pad Conditioning and Removal Rate Stability in Oxide Chemical Mechanical Planarization
Evaluation of ESM-U Pad With Varied Silica Slurries for Oxide Chemical Mechanical Polishing Process