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      KCI등재 SCIE SCOPUS

      Fabrication of high-aspect-ratio micropatterns in soluble block-copolymer polyimides by a UV-assisted thermal imprint process

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      https://www.riss.kr/link?id=A106324984

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      다국어 초록 (Multilingual Abstract)

      High-aspect-ratio microstructures (HARMS) of polyimides have many applications, such as components of microelectromechanical systems and X-ray gratings. This study demonstrates the fabrication of HARMS with vertical and smooth sidewalls in a thick, so...

      High-aspect-ratio microstructures (HARMS) of polyimides have many applications, such as components of microelectromechanical systems and X-ray gratings. This study demonstrates the fabrication of HARMS with vertical and smooth sidewalls in a thick, soluble block-copolymer polyimide (SBCP) film by an UV-assisted thermal imprint process. A preheating condition was controlled as a parameter that dominated the imprint pattern fidelity. After investigating a proper prebaking condition, patterns with a width of 3.4 μm and a height of 35.1 μm with a high-aspect ratio of 10 were successfully structured in an SBCP film that has a thickness of approximately a hundred micrometers. The process has potential as a low-cost fine pattern fabrication process for polyimide-based polymers.

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      참고문헌 (Reference)

      1 S. H. Lee, "Thermal stress analysis for polyimide thin film : The effect of solvent evaporation" 9 : 281-286, 2000

      2 S. C. Park, "Simplified Cu/polyimide damascene approach based on imprint process of soluble block copolymer polyimide" 52 : 10-, 2013

      3 S. W. Youn, "Selective Cu patterning on polyimide using UV surface treatment and electroless plating" 28 (28): 157-161, 2015

      4 T. Nishino, "Residual stress and microstructures of aromatic polyimide with different imidization processes" 41 : 6913-6918, 2000

      5 J. Huang, "Research on patterning of polyimide" 32 : 779-784, 2012

      6 D. -R Chiou, "Pretilt angle of liquid crystals and liquid-crystal alignment on microgrooved polyimide surfaces fabricated by soft embossing method" 22 : 9403-9408, 2006

      7 S. Kinuta, "Polyimide-based X-ray masks with advanced performance of pattern accuracy and thermal stability" 16 : 1299-1302, 2010

      8 B. Cui, "Polyimide nanostructures fabricated by nanoimprint lithography and its applications" 83 : 906-909, 2006

      9 Y. W. Wang, "Photosensitive polyimide/silica hybrid optical materials: Synthesis, properties, and pattering" 46 : 6959-6967, 2005

      10 L. Li, "Photosensitive polyimide(PSPI)materials containing inorganic nano particles(I)PSPI/TiO2hybrid materials by sol-gel processs" 74 : 210-213, 2002

      1 S. H. Lee, "Thermal stress analysis for polyimide thin film : The effect of solvent evaporation" 9 : 281-286, 2000

      2 S. C. Park, "Simplified Cu/polyimide damascene approach based on imprint process of soluble block copolymer polyimide" 52 : 10-, 2013

      3 S. W. Youn, "Selective Cu patterning on polyimide using UV surface treatment and electroless plating" 28 (28): 157-161, 2015

      4 T. Nishino, "Residual stress and microstructures of aromatic polyimide with different imidization processes" 41 : 6913-6918, 2000

      5 J. Huang, "Research on patterning of polyimide" 32 : 779-784, 2012

      6 D. -R Chiou, "Pretilt angle of liquid crystals and liquid-crystal alignment on microgrooved polyimide surfaces fabricated by soft embossing method" 22 : 9403-9408, 2006

      7 S. Kinuta, "Polyimide-based X-ray masks with advanced performance of pattern accuracy and thermal stability" 16 : 1299-1302, 2010

      8 B. Cui, "Polyimide nanostructures fabricated by nanoimprint lithography and its applications" 83 : 906-909, 2006

      9 Y. W. Wang, "Photosensitive polyimide/silica hybrid optical materials: Synthesis, properties, and pattering" 46 : 6959-6967, 2005

      10 L. Li, "Photosensitive polyimide(PSPI)materials containing inorganic nano particles(I)PSPI/TiO2hybrid materials by sol-gel processs" 74 : 210-213, 2002

      11 J. A. Bride, "Photolithographic micromolding of ceramics using plasma etched polyimide patterns" 63 : 3379-3381, 1993

      12 I. -T. Pai, "Nanostructures prepared on polyimide film by nanoimprinting with the assistance of residual solvent" 16 : 2192-2196, 2006

      13 K. Suzuki, "Nanopatterning on soluble block copolymer polyimide by nanoimprint" 54 : 088002-, 2015

      14 A. B. Frazier, "High aspect ratio electroplated microstructures using a photosensitive polyimide process" 2 : 87-92, 1992

      15 H. Komatsuzaki, "Flexible polyimide micropump fabricated using hot embossing" 50 : 06-, 2011

      16 H. Hah, "Effect of the shape of imprinted alignment layer on the molecular orientation of liquid crystal" 27 : 798-801, 2007

      17 S. W. Youn, "Dynamic mechanical thermal analysis, forming and mold fabrication studies for hot-embossing of a polyimide microfluidic platform" 18 : 045025-, 2008

      18 J. Engel, "Development of polyimide flexible tactile sensor skin" 13 : 359-366, 2003

      19 K. Suzuki, "Cu/Polyimide multilayer interconnections fabricated by nanoimprint at every lithography process" 27 (27): 73-80, 2014

      20 U. Kang, "A high-speed capacitive humidity sensor with on-chip thermal reset" 47 : 702-710, 2000

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2012-11-05 학술지명변경 한글명 : 대한기계학회 영문 논문집 -> Journal of Mechanical Science and Technology KCI등재
      2010-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2008-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2006-01-19 학술지명변경 한글명 : KSME International Journal -> 대한기계학회 영문 논문집
      외국어명 : KSME International Journal -> Journal of Mechanical Science and Technology
      KCI등재
      2006-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2004-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2001-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      1998-07-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 1.04 0.51 0.84
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.74 0.66 0.369 0.12
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