The high speed feeding units, that are known generally weak points at the high speed semiconductor press are developed to increase feeding velocity up to 155%. The new designed feeding units has the performance, feeding velocity 170spm, positioning ac...
The high speed feeding units, that are known generally weak points at the high speed semiconductor press are developed to increase feeding velocity up to 155%. The new designed feeding units has the performance, feeding velocity 170spm, positioning accuracy under 100㎛, decrease of link joint in feeding units, overload monitoring system with high sensitivity.