http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
https://www.riss.kr/link?id=O60871804
Qin, G. ; Nie, L. ; Toth, F. ; Aspandiar, R. ; Williams, I.
2012년
eng
학술저널
SMTA INTERNATIONAL CONFERENCE
29-39 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
9781622768967
Surface Mount Technology Association
International Conference
Orlando, FL
2012; Oct
0
상세조회0
다운로드
Board Level Reliability Cyclic Bend Test Study on WCSP Packages
Drop Reliability Test on Different Dimensional Lead-Free Wafer Level Chip Scale Packages
Mechanical Reliability: Updated Results from a Spherical Bend Test Program
On the Fatigue Life of Microelectronic Interconnects in Cycling With Varying Amplitudes