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あぁかがさざただなはばぱまやゃらわゎんいぃきぎしじちぢにひびぴみりうぅくぐすずつづっぬふぶぷむゆゅるえぇけげせぜてでねへべぺめれおぉこごそぞとどのほぼぽもよょろを

アァカサザタダナハバパマヤャラワヮンイィキギシジチヂニヒビピミリウゥクグスズツヅッヌフブプムユュルエェケゲセゼテデヘベペメレオォコゴソゾトドノホボポモヨョロヲ ―

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Ä Ö Ü ä ö ü ß

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½ ⅓ ⅔ ¼ ¾ ⅛ ⅜ ⅝ ⅞ ¹ ² ³ ⁴ ⁿ ₁ ₂ ₃ ₄

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RISS 인기검색어

전자기적 결합을 이용한 이층 마이크로스트립선로의 접속 구조 = Interconnection structures of bilevel microstriplines using electromagnetic coupling

한글로보기

https://www.riss.kr/link?id=A106789301

저자

박기동 ; 이현진 ; 임영석
발행기관
대한전자공학회
학술지명
전자공학회논문지A
권호사항

Vol.32 No.8 [1995]
발행연도
1995
작성언어
Korean
자료형태
학술저널
발행기관 URL
http://www.ieek.or.kr
수록면

47-55(9쪽)
제공처
ScienceON

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다국어 초록 (Multilingual Abstract)

Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are considered, collinear lines, transverse lines and modified EMC structure. From the analyzed results, it is found that these EMC interconnections have the coupling coefficient enough to interconnect lines in bilevel structures over a broad-band. The computed results of the modified EMC structure was compared with measurement from physical model and the computed results of via hole interconnection.

번역하기

Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are consider...

Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are considered, collinear lines, transverse lines and modified EMC structure. From the analyzed results, it is found that these EMC interconnections have the coupling coefficient enough to interconnect lines in bilevel structures over a broad-band. The computed results of the modified EMC structure was compared with measurement from physical model and the computed results of via hole interconnection.