Formulation Prediction for Young's Modulus of Poly(dimethylsiloxane) by Spectroscopic Methods

다국어 초록 (Multilingual Abstract)

In this work, we refer to the fraction of hydrides and vinyl groups consumed in cross‐linking reaction as a variation of the properties of poly(dimethylsiloxane) (PDMS) with varying the formulation of a curing agent from 3.2 wt % to 50 wt %. Young's modulus, density, and refractive indices of PDMS were observed to have a maxima at a formulation of about 10 wt % of cross linker. The intensity of the Raman band for the SiH stretching mode in cross‐linker is almost zero if the cross‐linking agent is less than 10 wt %, but it is linearly increasing with increasing the content of cross‐linker. The dependence of the elastic modulus on the formulation could be explained in terms of the fraction of cross‐linked network. The analytical framework proposed in this work could be used for optimizing the formulation of PDMS and hence its properties can be tailored for specific applications.
In this work, we have propose a framework to correlate the dependence of the properties of PDMS on its formulation with the fraction of SiH as well as CC bond, which consumed by cross‐linking reaction. The effect of the formulation on the mechanical, physical, optical, and wetting properties was investigated by measuring the Young's modulus, density, refractive index, and contact angle of the resultant solid PDMS substrate. These properties showed extrema at the formulation of around 10 wt % curing agent. We have further tried to study the content of SiH and CC groups in quantitatively by utilizing Raman spectroscopy and UV absorption spectrophotometry, respectively. We successfully explained the dependence of the above properties of the PDMS on the formulation in terms of the fraction of the cross‐linked network. Finally, we confidently propose that the analytical framework developed in this work can be useful to predict a formulation to optimize the properties of PDMS for future applications in the biomedical and industrial fields.