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Electrical Properties and Reliability of ALD TaN Barrier for Sub-90nm Pitch Cu Interconnects
Bolom, T.; Lee, J.; Zhang, X.; Justison, P.; Oh, M.; Siomon, A.; Flaitz, P.; Nag, J.; Baumann, F.; Filippi, R. Austin, Texas; SEMATECH 2013 p.1-6
Perspectives into CVD-Cobalt Liner Induced Increase in Resistivity of Cu Interconnect
Lin, W.; Zhang, X.; Nogami, T.; Parks, C.; Li, J.; Demarest, J.; Edelstein, D. Austin, Texas; SEMATECH 2013 p.7-15
Lower PPM Level EM Reliability Performance
Aubel, O.; Justison, P.; Hauschildt, M.; Talut, G.; Gall, M. Austin, Texas; SEMATECH 2013 p.16-27
Surface Chemistry Enhanced Selective ALD of Co Capping Layers on Cu
Elko-Hansen, T.; Ekerdt, J. Austin, Texas; SEMATECH 2013 p.28-35
Choi, K. Austin, Texas; SEMATECH 2013 p.36-47
Morin, P.; Brunetti, G.; Gregoire, M.; Gratie, B.; Clement, L.; Lagrasta, S.; Rouviere, J. Austin, Texas; SEMATECH 2013 p.48-56
Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration
Mizushima, Y.; Kim, Y.; Nakamura, T.; Sugie, R.; Hashimoto, H.; Uedono, A.; Ohba, T. Austin, Texas; SEMATECH 2013 p.72-82
Hofmann, L.; Baum, M.; Schulz, S.; Wiemer, M.; Gessner, T. Austin, Texas; SEMATECH 2013 p.83-95
Monitoring Water Uptake During Immersion of ULK Materials by Impedance Spectroscopy
Cherif, K.; Haumesser, P. Austin, Texas; SEMATECH 2013 p.96-106