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https://www.riss.kr/link?id=O47635451
2006년
eng
1938-5862
1938-6737
학술저널
ECS TRANSACTIONS
217-226 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
156677506X
Semiconductor wafer bonding; science, technology, and applications
International symposium; 9th
Cancun, Mexico
2006; Nov
0
상세조회0
다운로드
Can 3-D Devices Extend Moore's Law Beyond the 32 nm Technology Node?
New Heterostructures and 3D Devices Obtained at CEA/LETI by the Bonding and Thinning Method
Automotive Semiconductor Devices Using Bonded SOI Wafers
Thin Film Transfer for the Fabrication of Multiple Gate MOS Transistors