1 김성걸, "플립칩의 매개변수 변화에 따른 보드레벨의 동적신뢰성평가" 한국생산제조시스템학회 20 (20): 559-563, 2011
2 Müller, F. R, "Reliability of MEMS- A Methodical Approach" 42 (42): 1771-1776, 2002
3 Yates, W. D, "Reliability Advisor Expert System" 4 : 1346-1348, 1988
4 Yiping, W, "RFID Tag Manufacturing" 4 (4): 4-7, 2004
5 Imhoff, A. C, "Packaging Technologies for RFICs: Current Status and Future Trends" 7-10, 1999
6 Richard, K, "Non-hermeticity of Polymeric Lid Sealants" 13 (13): 147-152, 1977
7 Wagner, U, "Mechanical Reliability of MEMS-structures under Shock Load" 41 (41): 1657-1662, 2001
8 MIL-STD, "MIL-STD-883, Military Standards"
9 Hal, G, "Hermeticity of Electronic Packages" William Andrew Publishing 2000
10 An, B, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive" 60-63, 2007
1 김성걸, "플립칩의 매개변수 변화에 따른 보드레벨의 동적신뢰성평가" 한국생산제조시스템학회 20 (20): 559-563, 2011
2 Müller, F. R, "Reliability of MEMS- A Methodical Approach" 42 (42): 1771-1776, 2002
3 Yates, W. D, "Reliability Advisor Expert System" 4 : 1346-1348, 1988
4 Yiping, W, "RFID Tag Manufacturing" 4 (4): 4-7, 2004
5 Imhoff, A. C, "Packaging Technologies for RFICs: Current Status and Future Trends" 7-10, 1999
6 Richard, K, "Non-hermeticity of Polymeric Lid Sealants" 13 (13): 147-152, 1977
7 Wagner, U, "Mechanical Reliability of MEMS-structures under Shock Load" 41 (41): 1657-1662, 2001
8 MIL-STD, "MIL-STD-883, Military Standards"
9 Hal, G, "Hermeticity of Electronic Packages" William Andrew Publishing 2000
10 An, B, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive" 60-63, 2007
11 Finn, J, "Electronic Component Reliability" John Wiley 21-153, 1995
12 McCluskey, P, "Design for Reliability of Microelectro- mechanical Systems" 760-762, 2002
13 Davy, J. G, "Calculation for Leak Rates of Hermetic Packages" 11 (11): 177-189, 1975
14 Khanna, P. K, "Analysis of Packaging and Sealing Techniques for Microelectronics Modules and Recent Advances" 16 (16): 8-12, 1999
15 Stanley R, "A Rapid Cycle Method for Gross Leak Testing With the Helium Leak Detector" 3 (3): 564-570, 1980
16 Bieda, J, "A Product-cycle Cost-analysis Process and Its Application to the Automotive Environment" 422-425, 1992