Skutterudite: Reproducibility of Thermoelectric Performance of P-type RyFe4-xCoxSb12 Bulky Compacts = Microstructure and Texture Evolution in Thermomechanically Processed FCC Metals and Alloys: a Review

다국어 초록 (Multilingual Abstract)

The stacking fault energy (SFE) of face-centered cubic (FCC) alloys is a critical parameter thatcontrols microstructural and crystallographic texture evolution during deformation and annealingtreatments. This review focuses on several FCC alloys, aluminum (Al), copper (Cu), austenitic stainlesssteels (ASSs), and high entropy alloys (HEAs), all of which exhibit varying SFEs. These alloys are oftensubjected to thermo-mechanical processing (TMP) to enhance their mechanical properties. TMP leads to theevolution of deformation-induced products, such as shear bands (SBs), strain-induced martensite (SIM), andmechanical/deformation twins (DTs) during plastic deformation, while also influencing crystallographictexture. High-medium SFE materials, such as Al and Cu, typically exhibit the evolution of Copper-typetexture during room temperature rolling (RTR), while low SFE materials, such as ASSs and HEAs, displayBrass-type texture at high reduction ratios. Moreover, the presence of second-phase particles/precipitatescan also impact the microstructure and texture evolution in Al and Cu alloys. Particle-stimulated nucleation(PSN) during the annealing treatment has been reported for Al, Cu, ASSs, and HEAs, which causes textureweakening. Another interesting observation in severely deformed Cu alloys is the room-temperaturesoftening phenomenon, which is discussed in the reviewed work. Additionally, plastic deformation and heattreatment of ASSs result in phase transformation, which was not observed in Al, Cu, or HEAs.
Furthermore, the dependence of special boundaries in HEAs on plastic deformation temperature, strainrate, and annealing temperature is also discussed. Thus, this review comprehensively reports on the impactof TMP on microstructural and crystallographic texture evolution during plastic deformation and theannealing treatment of Al, Cu, ASSs, and HEAs FCC materials, using results obtained from electronmicroscopy.