<P><B>Abstract</B></P> <P>A solid oxide fuel cell (SOFC) stack requires metallic interconnects to electrically connect unit cells, while preventing fuel from mixing with oxidant. During SOFC operations, chromia scales co...
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https://www.riss.kr/link?id=A107701597
2018
-
SCOPUS,SCIE
학술저널
11576-11581(6쪽)
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
<P><B>Abstract</B></P> <P>A solid oxide fuel cell (SOFC) stack requires metallic interconnects to electrically connect unit cells, while preventing fuel from mixing with oxidant. During SOFC operations, chromia scales co...
<P><B>Abstract</B></P> <P>A solid oxide fuel cell (SOFC) stack requires metallic interconnects to electrically connect unit cells, while preventing fuel from mixing with oxidant. During SOFC operations, chromia scales continue to grow on the interconnect surfaces, resulting in a considerable increase of interfacial resistance, and at the same time, gaseous Cr species released from the chromia scales degrades the cathode performance. To address these problems, in this study, protective Mn<SUB>2</SUB>CuO<SUB>4</SUB> coatings are fabricated on metallic interconnects (Crofer 22 APU) <I>via</I> a plasma spray (PS) process. The PS technique involves direct spray deposition of molten Mn<SUB>2</SUB>CuO<SUB>4</SUB> onto the interconnect substrate and leads to the formation of high-density Mn<SUB>2</SUB>CuO<SUB>4</SUB> coatings without the need for post-heat-treatment. The thickness, morphology, and porosity of the PS-Mn<SUB>2</SUB>CuO<SUB>4</SUB> coating are found to depend on the processing parameters, including plasma arc power, gas flow rate, and substrate temperature. The PS-Mn<SUB>2</SUB>CuO<SUB>4</SUB> coating fabricated with optimized parameters is completely impermeable to gases and has high adhesion strength on the interconnect substrate. Furthermore, no resistive chromia scales are formed at the coating/substrate interface during the PS process. As a result, the PS-Mn<SUB>2</SUB>CuO<SUB>4</SUB>-coated interconnects show a very low area-specific resistance below 10 mΩ cm<SUP>2</SUP> at 800 °C in air and excellent stability during both continuous operation and repeated thermal cycling. This work suggests that an appropriate combination of the material and coating process provides a highly effective protective layer for SOFC interconnects.</P>