Recently, Along with the increasing demands for ultraprecision processing parts and polishing in inner surface of cylinder, a variety of studies which can be realized in processing of high quality by development of polishing system for ultraprecision ...
Recently, Along with the increasing demands for ultraprecision processing parts and polishing in inner surface of cylinder, a variety of studies which can be realized in processing of high quality by development of polishing system for ultraprecision polishing is actively processing in recent decades. Therefore, in this study, we developed polishing device in inner surface of cylinder using abrasive film and a studied on the basic polishing characteristic. According to both particle size of polishing film and backing film thickness, we experimented on the polishing characteristic and measured surface roughness. From this result, In the case of SM45C, if abrasive particles are rough and backing film is thick, the optimal polishing time shows a tendency to decrease. Also, we obtained high-efficient surface roughness.