Microstructure Evolution and Modeling of 2024 Aluminum Alloy Sheets During Hot Deformation Under Different Stress States

다국어 초록 (Multilingual Abstract)

In this work, specimens of the 2024 aluminum alloy sheet were compressed and stretched along the original rollingdirection at elevated temperatures. The microstructure evolution was investigated by characterizing the metallographicstructures via electron backscattered diffraction technology before and after deformation. It was foundthat while recrystallization occurred in the compressed specimens, it was not observed to the same extent in thestretched specimens. This difference in the grain morphology has been attributed to the different movement behaviorsof the grain boundaries, i.e., their significant migration in the compression deformation and the transformationfrom low-angle to high-angle boundaries observed mainly during tension deformation. The empirical model,which can describe the grain size evolution during compression, is not suitable in the case of tension, and therefore,a new model which ignores the detailed recrystallization process has been proposed. This model provides adescription of the grain size change during hot deformation and can be used to predict the grain size in the plasticdeformation process.

참고문헌 (Reference)

1 R. Manna, 31 : 1625-, 1996

2 T. Sakai, 60 : 130-, 2014

3 D. L. Yin, 392 : 320-, 2005

4 Y. Xun, 52 : 187-, 2004

5 A. Chamanfar, 615 : 497-, 2014

6 J. Lin, 167 : 354-, 2005

7 C. M. Sellar, 1 : 325-, 1985

8 F. Yin, 55 : 560-, 2014

9 J. J. Jonas, 57 : 2748-, 2009

10 T. Dursun, 56 : 862-, 2014

11 Z. L. Hu, 32 : 5055-, 2011

12 X. Feaugas, 87 : 989-, 2007

13 B. Shen, 625 : 288-, 2015

14 L. Deng, 81 : 1049-, 2014

15 J. D. Seidt, 50 : 1781-, 2013

16 L. Wang, 528 : 2648-, 2011

17 M. Weiss, 212 : 877-, 2011

18 H. E. Hu, 488 : 64-, 2008

19 H. E. Hu, 59 : 1185-, 2008

20 X. J. Duan, 351 : 282-, 2003

21 D. P. Field, 103 : 33-, 2005

22 E. Demir, 57 : 559-, 2009

23 K. Graetz, 67 : 58-, 2014

24 P. J. Hurley, 51 : 4737-, 2003

25 W. Blum, 205 : 23-, 1996

26 W. C. Liu, 49 : 3347-, 2001