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Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI
Ravikumar, V.K.; Wampler, R.; Ho, M.Y.; Christensen, J.; Phoa, S.L. ASM International; 1998 2012 p.1-5
Lu, Y.; Ramsay, E.; Stockbridge, C.R.; Yurt, A.; Koklu, F.H.; Bifano, T.G.; Unlu, M.S.; Goldberg, B.B. ASM International; 1998 2012 p.6-10
Fault Isolation of Open Defects Using Space Domain Reflectometry
Xie, M.; Qian, Z.; Pacheco, M.; Wang, Z.; Dias, R.; Talanov, V. ASM International; 1998 2012 p.11-16
Localization of Dead Open in a Solder Bump by Space Domain Reflectometry
Vallett, D.P.; Bader, D.A.; Talanov, V.V.; Gaudestad, J.; Gagliolo, N.; Orozco, A. ASM International; 1998 2012 p.17-20
Cao, L.; Venkata, M.; Tay, M.Y.; Qiu, W.; Alton, J.; Taday, P.; Igarashi, M. ASM International; 1998 2012 p.21-25
Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal
Hrncir, T.; Lopour, F.; Zadrazil, M.; Delobbe, A.; Salord, O.; Sudraud, P. ASM International; 1998 2012 p.26-29
FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices
Colvin, J. ASM International; 1998 2012 p.30-38
Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma- FIB Milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L. ASM International; 1998 2012 p.39-43
Microstructural Considerations on the Reliability of 3D Packaging
Huang, Z.; Wu, Z.; Xiong, H.; Ma, Y. ASM International; 1998 2012 p.44-49
High-Frequency TSV Failure Detection Method with Z Parameter
Kim, J.; Jung, D.H.; Cho, J.; Pak, J.S.; Kim, J.; Yook, J.M.; Kim, J.C. ASM International; 1998 2012 p.50-54