금속 접합 PCB를 적용하여 방열 특성을 개선시킨 높은 전력밀도의 스위칭 정류기 모듈에 관한 연구

다국어 초록 (Multilingual Abstract)

In this paper, the experimental result on switching rectifier module with high power density which improved heat dissipation characteristics by metal bonded PCB was reported with a prototype. The height of the switching rectifier module was lowered under 13mm, and power density was increased to 127W/in³ while the module was designed with maximum output of 700W class. To minimize the internal heat and losses, bridgeless boost converter circuit was applied. As a consequence, the prototype was performed with 97.5% of maximum power transition efficiency and 99.8% of maximum power factor, hence it was confirmed that the prototype was stably operated under its maximum output by transferring the internal loss to outside effectively.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 브릿지리스 방식의 스위칭 정류기
• 3. 금속접합 PCB의 특성
• 4. 고밀도 정류기 모듈의 구성
• 5. 시험결과
• 6. 결론
• References

참고문헌 (Reference)

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