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2 A. Rinaldi, "Statistical damage mechanics and extreme value theory" 16 : 57-76, 2015
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7 M. Choi, "Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography" 41 : 119-124, 2008
8 T. Tian, "Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints" 65 : 646-649, 2011
9 M. Clark, "Non-contact acoustic microscopy" 11 : 1792-1801, 2000
10 H. Xiao, "Introduction to Semiconductor Manufacturing Technology" SPIE press in United States 2012
1 G. Busse, "Thermal wave imaging with phase sensitive modulated thermography" 71 (71): 3962-3965, 1992
2 A. Rinaldi, "Statistical damage mechanics and extreme value theory" 16 : 57-76, 2015
3 G. Traxler, "Square pulse thermography system design considerations for detection of voids inside of the material with different properties and finite differences" 5679 : 118-128, 2005
4 R. H. Chan, "Salt-and-pepper noise removal by mediantype noise detectors and detail-preserving regularization" 14 : 1479-1485, 2005
5 J. Liu, "Research on thermal wave processing of lock-in thermography based on analyzing image sequences for NDT" 53 : 348-357, 2010
6 C. Meola, "Recent advances in the use of infrared thermography" 15 : R27-R58, 2004
7 M. Choi, "Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography" 41 : 119-124, 2008
8 T. Tian, "Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints" 65 : 646-649, 2011
9 M. Clark, "Non-contact acoustic microscopy" 11 : 1792-1801, 2000
10 H. Xiao, "Introduction to Semiconductor Manufacturing Technology" SPIE press in United States 2012
11 A. Haleh, "Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging" 26 : 206-214, 2003
12 W. Bai, "Evaluation of defects in composite plates under convective environments using lock-in thermography" 12 : 142-150, 2001
13 C. Y. Khor, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flipchip package" 39 : 670-680, 2012
14 M. Balu, "Effect of excitation wavelength on penetration depth in nonlinear optical microscopy of turbid media" 14 : 010508-, 2009
15 S. Dudzik, "Approximation of thermal background applied to defect detection using the methods of active thermography" 17 : 621-636, 2010
16 M. K. Abdullah, "A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-CHIP scale packages (S-CSP)" 28 : 2527-2538, 2009
17 HL. John IV, "A heat transfer textbook" Phlogiston Press in United States 2008