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https://www.riss.kr/link?id=O40549487
1999년
eng
1550-5723
학술저널
INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS
118-124 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0930815564; 0780355083
Advanced packaging materials
International symposium
Braselton; GA
1999; Mar
0
상세조회0
다운로드
Conductive Adhesive Development Concept using a Bimodal Distribution of Ag-particles
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICAs)
Development of Solderless Joining Technologies using Conductive Adhesives
Characterization of Silver Flakes Utilized for Isotropic Conductive Adhesives