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이 학술지의 논문 검색
The significance of bonding technology in the past and the future
Brockmann, W. unknown 2000 p.1-12
Interface formation and adhesion of metal films on polymers
Faupel, F.; Bechtolsheim, C. v.; Behnke, K.; Dolgner, K.; Kiene, M.; Strunskus, T.; Thran, A.; Zaporojtchenko, V. unknown 2000 p.17-20
Investigation of the mechanism of mechanical pretreatments
Neeb, T.; Brockmann, W. unknown 2000 p.21-30
Functionalizing of polymer surfaces in pulsating plasma followed by chemical pretreatment
Friedrich, J.; Ghode, A.; Kuhn, G.; Retzko, I. unknown 2000 p.31-44
Environmental friendly cleaning and activating of metallic surfaces by pulsated electrical discharge
Grosser, S.; Kleinert, H. unknown 2000 p.45-54
Development and application of textile reinforcements for the rubber industry
Kiesewetter, J. unknown 2000 p.55-68
The mechanism of cathodic disbonding
Cherry, B. W.; Edmonds, L.; Forsyth, M. unknown 2000 p.69-80
High temperature resistant adhesives in electrical engineering and electronics
Born, E. unknown 2000 p.81-94
New two parts adhesive technology based on combining the chemistry of acrylates and polyurethanes
Lohse, H. unknown 2000 p.95-106