As the technology in LCD(Liquid Crystal Display) industry has been developed, the demand has been increased more and more. Application areas and fields of use have been spreading quickly such as laptops, cell phones, game consoles and etc.
The displ...
As the technology in LCD(Liquid Crystal Display) industry has been developed, the demand has been increased more and more. Application areas and fields of use have been spreading quickly such as laptops, cell phones, game consoles and etc.
The display market will have more various ranges of application, and the glass substrate will get larger for high productivity. To provide high productivity and to achieve cost-saving effects, device makers have made an effort to reduce and improve the process time.
Cleaning is an extremely important process in TFT-LCD(Thin Film Transistor-Liquid Crystal Display) manufacturing processes. It is included in all the processes such as TFT manufacturing, cell process, and module process. In addition, the cleaning process is necessary to remove micro-particles, various ions, unnecessary thin films, residues, etc. Cleaning methods are divided into a wet cleaning and dry cleaning, and the wet cleaning consists of a physical cleaning and chemical cleaning. The cleaning equipment using a brush cleaning, bubble Jet, and AA (Aqua / Air) jet is to clean a substrate physically for improving the cleaning efficiency and the yield improvement of LCD panels as early as possible.
In this study, we found out the relation of cleaning ability between the pressure conditions of AA jet and brush depth and the optimize process conditions by changing brush depth and rpm, and pressures of bubble jet and AA jet. The cleaning methods and conditions presented in this study contribute to the improvement of productivity (yield) and development of the next generation cleaning process and equipment.