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https://www.riss.kr/link?id=O41821711
2004년
eng
1521-3331
1557-9972
SCI;SCIE;SCOPUS
학술저널
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
79-80 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
Thermal investigations of ICs and systems; The 8th THERMINIC workshop
Workshop; 8th
Madrid
2002; Oct
0
상세조회0
다운로드
Influence of Electrical and Mechanical Parameters on Contact Welding in Low Power Switches
The Effects of Material Transfer in Relays Diagnosed by Force and/or Voltage Measurement
Impact of Lead-Free Soldering Processes on the Performance of Signal Relay Contacts