간섭식 모아레를 이용한 전자 패키지의 실시간 신뢰성 모니터링 시스템

다국어 초록 (Multilingual Abstract)

Like a diagnosis of human body, it is important to monitor the conditions of electronic package in use. Even if electronic package is well made, thermal cycles in use make the fatigue crack that makes the system failure eventually. If we know the crack length in the package in real-time, the great damage is prevented before the system failure. In this day, there are no simple methods for real-time monitoring electronic package in use. In this research, we propose the non-destructive method that detects the crack length in electronic package. When the crack occurs, thermal deformation on the chip side is changed. So, we can measure these deformations by using moire interferometry and find out the crack length. The monitoring method that is proposed is applied to the ACF type package specimens.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 모니터링 시스템
• 3. 실험 결과
• 4. 결론
• 후기
• 참고문헌