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https://www.riss.kr/link?id=O48030979
2007년
eng
학술저널
SMTA INTERNATIONAL -CD-ROM EDITION-
107-112 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
Surface Mount Technology Association; SMTA International
CONFERENCE
Orlando, FL
2007; Oct
0
상세조회0
다운로드
PEEK for Lead-Free Soldering Processes and Electronics Applications
Elimination of Flip Chip Electromigration Failures using Embedded Chip Build-Up Technology
Through Silicon Via Interconnection Enabling 3D Wafer-Level SiP
Electrical Characterizations of TSOP II and FBGA Packages for High-Speed Applications