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https://www.riss.kr/link?id=O40395952
1994년
eng
1089-8190
2576-9626
학술저널
INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM
340-343 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780320379; 0780320387; 0780320395
16th International electronics manufacturing technology symposium
La Jolla; CA
1994; Sep
0
상세조회0
다운로드
Isothermal Creep of Eutectic SnBi and SnAg Solder and Solder Joints
The Design and Properties of New, Pb-Free Solder Alloys
New Solderiess Connection Technology Using Light-Setting Insulation Resin
AT&T Lead-Free Solder Paste for the Cost Effective Manufacture of Flip Chip Si-on-Si MCMs