초음파 진동을 이용한 ELID 연삭 가공 특성 연구 = Research of ELID Grinding Properties using Ultrasonic Vibration

다국어 초록 (Multilingual Abstract)

Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties.
ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer.
Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELIDground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was lower than ELID ground specimen without ultrasonic table.

목차 (Table of Contents)

• 1. 서론 1
• 2. 이론적 배경 4
• 2.1. ELID 연삭 가공 4
• 2.1.1. ELID 가공 메카니즘 4
• 2.1.2. ELID 가공 구성요소 7
• 2.2. 초음파 가공 10
• 3. 사파이어의 ELID 연삭 가공 12
• 3.1. 래핑 장치를 이용한 ELID 연삭 가공 12
• 3.1.1. ELID 가공 시스템 12
• 3.1.2. ELID 연삭 가공 방법 14
• 3.1.3. ELID 연삭 가공 결과 15
• 3.2. 평면 연삭기를 이용한 ELID 연삭 가공 18
• 3.2.1. ELID 가공 시스템 18
• 3.2.2. ELID 연삭 가공 및 결과 20
• 4. 진동을 이용한 ELID 연삭 가공 25
• 4.1. 초음파 진동 테이블 25
• 4.2. 초음파 진동을 이용한 ELID 연삭 가공 27
• 4.3. 패턴 특성 분석 35
• 4.3.1. 초음파 진동을 인가한 ELID 연삭 가공 35
• 4.3.2. 패턴 가공 결과 35
• 4.3.2. 마모 시험 43
• 5. 결론 47
• 참고 문헌 50
• Abstract 51