The physical properties of epoxy molding compound(EMC) according to the change of silica content as filler have been investigated in order to study the relationship between the content of silica, which is main filler of EMC for semiconductor encapsula...
The physical properties of epoxy molding compound(EMC) according to the change of silica content as filler have been investigated in order to study the relationship between the content of silica, which is main filler of EMC for semiconductor encapsulation, and EMC. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient and temperature of glass transition(Tg) as thermal properties, and spiral flow as mold ability have been investigated to see the change of physical properties of EMC. Flexural modulus of EMC increased with the silica content, and the minimum of flexural strength was observed in the region of 50% of silica content. The thermal expansion coefficients in the region below Tg(of) keep constant value according to the change of silica content. The minimum value of Tg was measured in the region of50% of silica content. It can be found out that spiral flow of EMC has the maximum value in the region of 50% of silica content, so mold ability has very good relationship with Tg. We have considered these system in respect of internal stress.