1 L. Yin, "Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding" 41 : 302-312, 2012
2 C.-F. Tseng, "Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish" 65 : 3216-3218, 2011
3 J. Standard, "Solder Ball Shear"
4 M. Ratzker, "Review of Capabilities of the ENEPIG Surface Finish" 43 : 3885-3897, 2014
5 C. Yu, "Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints" 23 : 124-129, 2012
6 B.-S. Lee, "Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications" 71 : 119-125, 2017
7 H. Kim, "Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes" 962-967, 2007
8 F. Song, "High-speed solder ball shear and pull tests vs. board level mechanical drop tests, correlation of failure mode and loading speed" 1504-1513, 2007
9 M. Amagai, "High drop test reliability, lead-free solders" 1302 : 1304-1309, 2004
10 D. Goyal, "Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface, Electronic Components and Technology Conference, 2002" 732-739, 2002
1 L. Yin, "Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding" 41 : 302-312, 2012
2 C.-F. Tseng, "Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish" 65 : 3216-3218, 2011
3 J. Standard, "Solder Ball Shear"
4 M. Ratzker, "Review of Capabilities of the ENEPIG Surface Finish" 43 : 3885-3897, 2014
5 C. Yu, "Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints" 23 : 124-129, 2012
6 B.-S. Lee, "Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications" 71 : 119-125, 2017
7 H. Kim, "Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes" 962-967, 2007
8 F. Song, "High-speed solder ball shear and pull tests vs. board level mechanical drop tests, correlation of failure mode and loading speed" 1504-1513, 2007
9 M. Amagai, "High drop test reliability, lead-free solders" 1302 : 1304-1309, 2004
10 D. Goyal, "Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface, Electronic Components and Technology Conference, 2002" 732-739, 2002
11 J. Y. Kim, "Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5 Ag solder joints" 57 : 5001-5012, 2009
12 J. Yu, "Effects of residual S on Kirkendall void formation at Cu/Sn-3.5 Ag solder joints" 56 : 5514-5523, 2008
13 C. E. Ho, "Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni" 31 : 584-590, 2002
14 W. Seo, "Effect of Bath Life of Ni (P) on the Brittle-Fracture Behavior of Sn-3.0 Ag-0.5 Cu/ENIG" 43 : 4457-4463, 2014
15 Y.-C. Sohn, "Correlation between chemical reaction and brittle fracture found in electroless Ni (P)/immersion gold-solder interconnection" 20 : 1931-1934, 2005
16 K. Newman, "BGA brittle fracture-alternative solder joint integrity test methods" 1194-1201, 2005
17 K. Harada, "Analysis of solder joint fracture under mechanical bending test" 1731-1737, 2003
18 N. Biunno, "A root cause failure mechanism for solder joint integrity of electroless nickel/immersion gold surface finishes" 1999