Particles on surfaces 8 : detection, adhesion and removal

목차 (Table of Contents)

• 자료제공 :
• Preface
• Part 1: Particle Analysis / Characterization and General Cleaning-Related Topics
• The nature and characterization of small particles
• R. Kohli
• Surface and micro-analytical methods for particle identification
• D.A. Cole, J. Humenansky, M. Kendall, P.J. McKeown, V. Pajcini and J.H. Scherer
• The haze of a wafer: A new approach to monitor nano-sized particles
• K. Xu, R. Vos, G. Vereecke, M. Lux, W. Fyen, F. Holsteyns, K. Kenis, P.W. Mertens, M.M. Heyns and C. Vinckier
• Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process
• C.C. Walton, D.J. Rader, J.A. Folta and D.W. Sweeney
• Particle deposition from a carry-over layer during immersion rinsing
• W. Fyen, K. Xu, R. Vos, G. Vereecke, P. Mertens and M. Heyns
• The use of surfactants to reduce particulate contamination on surfaces
• M.L. Free
• The use of rectangular jets for surface decontamination
• E.S. Geskin and B. Goldenberg
• Ice-air blast cleaning: Case studies
• D. Shishkin, E. Geskin, B. Goldenberg and O. Petrenko
• Development of a technique for glass cleaning in the course of demanufacturing of electronic products
• E.S. Geskin, B. Goldenberg and R. Caudill
• Part 2: Particle Adhesion and Removal
• Mechanics of nanoparticle adhesion a€” A continuum approach
• J. Tomas
• A new thermodynamic theory of adhesion of particles on surfaces
• M.A. Melehy
• Particle adhesion on nanoscale rough surfaces
• B.M. Moudgil, Y.I. Rabinovich, M.S. Esayanur and R.K. Singh
• Advanced wet cleaning of sub-micrometer sized particles
• R. Vos, K. Xu, G. Vereecke, F. Holsteyns, W. Fyen, L. Wang, J. Lauerhaas, M. Hoffman, T. Hackett, P. Mertens and M. Heyns
• Modified SC-1 solutions for silicon wafer cleaning
• C. Beaudry, J. Baker, R. Gouk and S. Verhaverbeke
• Investigation of ozonated DI water in semiconductor wafer cleaning
• J. DeBello and L. Liu
• Possible post-CMP cleaning processes for STI ceria slurries
• R. Small and B. Scott
• The ideal ultrasonic parameters for delicate parts cleaning
• T. Piazza and W.L. Puskas
• Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers
• S.L. Wicks, M.S. Lucey and J.J. Rosato
• Influences of various parameters on microparticles removal during laser surface cleaning
• Y.F. Lu, Y.W. Zheng, L. Zhang, B. Luka€™yanchuyk, W.D. Song and W.J. Wang
• Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer
• T. Hooper, Jr. and C. Cetinkaya
• Particle removal by collisions with energetic clusters
• J. Perel, J. Mahoney, P. Kopalidis and R. Becker