Electroless Ni-P metallization on palladium activated polyacrylonitrile (PAN) fiber by using a drying process

다국어 초록 (Multilingual Abstract)

<P><B>Abstract</B></P> <P>Polyacrylonitrile (PAN) fiber was metallized by nickel-phosphorus (Ni-P) in an electroless plating process. Firstly, the surface of PAN fiber was activated by palladium (Pd) nanocatalysts by using a drying process in which palladium(II) bis(acetylacetonate), Pd(acac)<SUB>2</SUB> was spontaneously reduced to Pd nanocatalysts in180 °C N<SUB>2</SUB> atmosphere without using any reducing agent. And then Ni-P alloy was coated on the Pd activated PAN fiber in an electroless Ni-P plating solution without using SnCl<SUB>2</SUB>-sensitizing solution. The morphology was observed by scanning electron microscopy (SEM) and elemental analyses were carried out by energy dispersive spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The composition ratio of Ni: P was 85.3: 14.7 atomic % and the growth rate of Ni-P layer decreased with increasing plating time. The thickness of Ni-P plating layers for 10, 30 and 60 min were 0.64, 1.03 and 1.22 μm, respectively. Electromagnetic interference shielding effectiveness (EMI-SE) of Ni-P plated PAN fiber (50 wt%)/epoxy composite was more than 30 dB in the frequency range from 30 MHz to 1500 MHz.</P> <P><B>Highlights</B></P> <P> <UL> <LI> A drying process is proposed to activate PAN fiber surface with Pd nanoparticles. </LI> <LI> Ni-P alloy is electrolessly plated on the Pd activated PAN surface. </LI> <LI> 1.22 μm thick Ni-P alloy was covered the PAN fiber. </LI> <LI> EMI shielding effectiveness was over 30 dB at 30–1500 MHz. </LI> </UL> </P>