리플로우 시간에 따른 Pb-free 솔더합금 접합부에 대한 고온 크리프 물성 평가

다국어 초록 (Multilingual Abstract)

Soldering is very important packaging core technology in bonding process and recently the importance of soldering technology came to the fore. Also, Depending on the trend of miniaturization, lightweight and high performance of electronic devices, mechanical property evaluation is significantly considered such as high temperature creep property of solder joints. According to the environmental policy about previously used Sn-Pb eutectic solder, many research about the Pb-free is studied in the world.
In this paper, in order to investigate the high temperature creep property of the solder joints about Sn-Pb eutectic solder and Sn-Ag-(Cu) types Pb-free solder, analyzed high temperature creep behavior using a shear punch-creep test equipment with reflow time(30, 100, 300sec) and various stress(4MPa ∼ 18MPa). Also, this research was observed behavior of intermetallic compound(IMC) that important factor in the creep characteristics and fracture appearance of solder joints after SP-Creep test used to scanning electron microscope(SEM) and energy dispersive x-ray spectroscopy(EDX). As a result, a creep behavior of Sn-Ag-(Cu) types Pb-free solder is more superior to Sn-Pb solder and showed different creep behavior under various solder joints. IMC and creep behavior of the same solder joints was changed according to reflow time.

목차 (Table of Contents)

• 목 차 i
• Abstract iii
• List of tables v
• List of figures ⅵ
• 제 1 장. 서 론 1
• 1-1. 연구배경 및 목적 1
• 1-1-1. Pb-free 솔더합금 개발의 필요성 1
• 1-1-2. 솔더접합부 고온 크리프 물성평가의 필요성 2
• 1-1-3. 리플로우 시간에 따른 솔더접합부 평가의 필요성 3
• 1-2. 국내▪외 연구동향 4
• 1-2-1. 국내 연구동향 4
• 1-2-2. 국외 연구동향 5
• 1-3. 이론적 배경 7
• 1-3-1. 리플로우(reflow) 시간과 솔더접합부 신뢰성 7
• 1-3-2. 솔더 접합부 계면 확산이론 8
• 1-3-3. 크리프 거동 10
• 제 2 장. 실험재료 및 실험방법 12
• 2-1. 실험재료 12
• 2-2. 실험편 제작 13
• 2-2-1. 솔더볼 제작 13
• 2-2-2. 기판(plate) 제작 13
• 2-2-3. 솔더 접합부 제작 14
• 2-2-3. 솔더 접합부 IMC 촬영 15
• 2-3. Shear-Punch Creep 시험 17
• 2-4 SP-Creep 시험 평가인자 21
• 2-5 실험조건 24
• 제 3 장. 실험결과 및 고찰 25
• 3-1. 솔더 접합부의 IMC 거동 25
• 3-2. 솔더 접합부의 고온 크리프 거동 31
• 3-3. Power-Law 관계 45
• 3-3-1. 작용응력과 정상상태 크리프 변형 속도 45
• 3-2-2. 작용응력과 파단수명 52
• 3-4. Larson-Miller Parameter(L.M.P) 59
• 3-5. 리플로우 시간에 따른 크리프 파단속도 63
• 3-6. 파면관찰 66
• 제 4 장. 결론 72
• 참고문헌 74