Improvements of Mechanical Fatigue Reliability of Cu Interconnects on Flexible Substrates through MoTi Alloy Under-Layer

다국어 초록 (Multilingual Abstract)

The mechanical fatigue of Cu films and lines on flexible substrates was investigated,and an improvement in the structures through the use of a MoTi alloy under-layerwas proposed. Fatigue reliability was decreased by 3-fold in lines compared withfilms in the tensile condition and by 6-fold in the compressive condition. Crackformation was observed to be more detrimental for lines than for films. With a MoTiunder-layer, the fatigue limit was increased by 2 times that of a structure withoutMoTi in the tensile condition and by 15 times in the compressive bending condition.
The suppression of delamination through the use of a MoTi under-layer improvedthe fatigue reliability under compressive bending.

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