1 서예리, "그라비어 인쇄에서 비도피지의 잉크 침투 시뮬레이션에 관한 연구" 한국인쇄학회 28 (28): 1-13, 2010
2 Hung-Wen Lin, "The rheological behaviors of screen-printing pastes" 284-291, 2008
3 J. T Youn, "Computer Simulation for Ink Transfer from Cell onto Paper in the Gravure" 2003
4 Jae-Sul Park, "A Study on the thick stencil making in the screen printing" 1-8, 1999
5 Jee-Soo Mok, "A Study on Via Interconnection with Conductive Paste using Screen Printing for PCB Manufacture"
1 서예리, "그라비어 인쇄에서 비도피지의 잉크 침투 시뮬레이션에 관한 연구" 한국인쇄학회 28 (28): 1-13, 2010
2 Hung-Wen Lin, "The rheological behaviors of screen-printing pastes" 284-291, 2008
3 J. T Youn, "Computer Simulation for Ink Transfer from Cell onto Paper in the Gravure" 2003
4 Jae-Sul Park, "A Study on the thick stencil making in the screen printing" 1-8, 1999
5 Jee-Soo Mok, "A Study on Via Interconnection with Conductive Paste using Screen Printing for PCB Manufacture"