Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates

다국어 초록 (Multilingual Abstract)

The use of printed circuit boards (PCBs) has become essential in manufacturing parts with electronic functions. However, the placement of PCBs inside a product requires special plates or fixtures that need to be separately designed, fabricated, and assembled. In addition, PCB manufacturing generally utilizes various toxic metals and etchants. Thus, there is a need to address the issues of space, cost, and environmental toxicity inherent in PCBs. This paper proposes a novel method of fabricating PCB-free part with electronic circuits in a set using the casing or exterior of a product. This process enables the manufacturing of a type of molded interconnect device without conventional molding technologies by directly forming conductive circuits on the side or back of 3D-printed substrates using selective electroless plating. For 3D printing of the product structure, this study uses substrates made of polylactic acid (PLA) and acrylonitrile butadiene styrene (ABS), which are commonly used in the popular material-extrusion 3D printing technology. As ABS and PLA have different chemical properties, the region to be plated with the electrical circuit is fabricated using ABS, whereas the remaining substrate is fabricated using PLA. ABS was chemically treated to allow electroless plating. A process for forming 3D circuits was developed and evaluated by selective electroless plating of the areas of the substrate requiring circuitry. To verify the applicability of the proposed process, circuits and integrated parts used in the industry were redesigned into a single component and fabricated by applying the proposed process. The results demonstrate that the proposed process has good practical applicability. Furthermore, it has low environmental toxicity with low requirements for material consumption and processing energy.

참고문헌 (Reference)

1 이동윤, "Trends in 3D Printing Technology for Construction Automation Using Text Mining" 한국정밀공학회 20 (20): 871-882, 2019

2 Yung, K. C., "Thermal performance of high brightness LED array package on PCB" 37 (37): 1266-1272, 2010

3 Tang, X., "Research on a new surface activation process for electroless plating on ABS plastic" 62 (62): 1089-1091, 2008

4 윤해룡, "Research of circuit manufacturing for new MID technology development" 대한기계학회 31 (31): 5737-5743, 2017

5 Lim, S. -G., "Research for generating circuit pattern of threedimensional plastic (ABS) structure" Andong National University 2016

6 Olivera, S., "Plating on acrylonitrile–butadiene–styrene(ABS)plastic : a review" 51 : 3657-3674, 2016

7 Haseung Chung, "Optimal Powder Deposition Process to Develop a New Direct-Write Additive Manufacturing System" 한국정밀공학회 20 (20): 1057-1067, 2019

8 Hong, M. S., "Mechanical properties and electromagnetic interference shielding behaviors of electroless nickel-loaded multi-walled carbon nanotube/chopped fibers-reinforced high density poly ethylene matrix composites" Jeonju University 2012

9 김형기, "Maintenance Framework for Repairing Partially Damaged Parts Using 3D Printing" 한국정밀공학회 20 (20): 1451-1464, 2019

10 강민규, "Flexible 2-Layer Paper Printed Circuit Board Fabricated by Inkjet Printing for 3-D Origami Electronics" 한국정밀공학회 5 (5): 421-426, 2018

11 Seunggyu Jeon, "Flexibility enhancement of poly(lactide-co-glycolide) for fused deposition modeling technology" 한국정밀공학회 6 (6): 465-475, 2019

12 Chen, M., "Evolution of electronic waste toxicity: Trends in innovation and regulation" 89–90 : 147-154, 2016

13 Haque, I. -U., "Electroless nickel plating on ABS plastics from nickel chloride and nickel sulfate baths" 27 (27): 246-249, 2005

14 김민경, "Effect of Fabrication Parameters on Surface Roughness of FDM Parts" 한국정밀공학회 19 (19): 137-142, 2018

15 Yanfeng Lu, "Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers" 대한기계학회 29 (29): 5377-5385, 2015

16 Hon, K. K. B., "Direct Writing technology—Advances and developments" 57 (57): 601-620, 2008

17 Kim, N. S., "Direct Writing Technology for 21st Century Industries -Focus on Micro-Dispensing Deposition Write Technology" 511-515, 2007

18 Cong Hong Phong Nguyen, "Design for Additive Manufacturing of Functionally Graded Lattice Structures: A Design Method with Process Induced Anisotropy Consideration" 한국정밀공학회 8 (8): 29-45, 2021

19 Elif Elçin Günay, "An Investigation on Process Capability Analysis for Fused Filament Fabrication" 한국정밀공학회 21 (21): 759-774, 2020

20 김호찬, "Additive manufacturing of smart insole by direct printing of pressure sensitive material" 대한기계학회 33 (33): 5609-5614, 2019

21 Lee, I. K., "A study on the Ni UBM using electroless Ni plating method" Seoul National University 2004

22 Jikai Liu, "A Topology Optimization Method for Hybrid Subtractive–Additive Remanufacturing" 한국정밀공학회 7 (7): 939-953, 2020

23 이정우, "A Review on 3D Printed Smart Devices for 4D Printing" 한국정밀공학회 4 (4): 373-383, 2017

24 Fuwen Hu, "A 3D Printed Paper-based Thermally Driven Soft Robotic Gripper Inspired by Cabbage" 한국정밀공학회 20 (20): 1915-1928, 2019

25 백병만, "3차원 레이저 다이렉트 패터닝 시스템 개발" 한국생산제조학회 21 (21): 116-122, 2012

26 Kim, S. Y., "3D circuit device by selective plating of 3D printing parts" Andong National University 2018

27 Faez Alkadi, "3D Printing of Ground Tire Rubber Composites" 한국정밀공학회 6 (6): 211-222, 2019

28 Luquan Ren, "3D Printing of Bioinspired Structural Materials with Fibers Induced by Doctor Blading Process" 한국정밀공학회 6 (6): 89-99, 2019

29 고형주, "3D MID 크루즈 컨트롤 스위치의 개발" 안동대학교 대학원 2014