다음극 직류전원플라즈마 화학 증착법에 의해 합성된 자유막 다이아몬드 웨이퍼의 특성 = Properties of a free-standing diamond wafer deposited by the multi-cathode direct current plasma assisted CVD method

다국어 초록 (Multilingual Abstract)

Properties of a free-standing diamond wafer with a diameter of 80 mm and a thickness of 900~950 $mu extrm{m}$ deposited by the multi-cathode direct current plasma assisted chemical vapor deposition (MCDC PACVD) method were investigated. Defects of the diamond film were observed by optical transmission microscopy and its crystallinity was characterized by Raman and IR spectroscopy. Defects were distributed partially on boundaries of the grain. In the grain, (111) plane contained a higher defect density than that on (100) plane. FWHM of Raman diamond peak and IR transmission at 10.6 $\mu\textrm{m}$ were 4.6 $\textrm{cm}^{-1}$ /~5.3 $\textrm{cm}^{-1}$ and 51.7 ~ 61.9 %, and their uniformity was $\pm$7% and $\pm$9%, respectively. The diamond quality decreased with going from center to edge of the wafer.

국문 초록 (Abstract)

다음극 DC PACVD법에서 합성된 직경 80 mm, 두께 900 $\mu\textrm{m}$ ~ 950 $\mu\textrm{m}$의 자유막 다이아몬드웨이퍼의 특성을 분석하였다. 광투과현미경으로 결함의 분포를 관찰하고, Raman 및 IR 장치로 결정성을 분석하였다. 결함은 결정입계 부위에서 많이 관찰되었다. 또한 하나의 결정립에서 (111)면이 (100)면에 비해 상대적으로 많은 결함을 함유하였다. Raman 다이아몬드 peak의 FWHM 및 10.6 $\mu\textrm{m}$ 파장에서의 IR 투과도는 각각 4.6 $\textrm{cm}^{-1}$ /~5.3 $\textrm{cm}^{-1}$및 51.7% ~ 61.9%로, 두 값의 웨이퍼 내에서 균일성은 $\pm$7% 및 $\pm$9%이었다. 다이아몬드 웨이퍼의 결정성은 가운데에서 가장자리로 갈수록 저하되었다.