Characterization of diamond wire-cutting performance for lifetime estimation and process optimization

다국어 초록 (Multilingual Abstract)

Diamond abrasive-coated wire is a tool for the precise multi-wire sawing of mono-crystal ingots to manufacture substrates. This tool is used to cut hard materials such as silicon carbide, gallium nitride, sapphire and silicon. The cutting performance of diamond wires strongly influences the accuracy of substrates in terms of roughness, total thickness variation and BOW. Nonetheless, changes in cutting performance as a result of gradual wear through repeated contact complicate the optimization of diamond wire use. A characterization method is proposed for the cutting performance and lifetime of a diamond wire based on mathematical modeling and experimental results.

The theoretical model predicts that cutting accelerates with the application of a strong feed force and small abrasives due to an increase in indentation depth for each abrasive. Experimental results showed that a wire with a low concentration exhibited an increased material removal rate. However, the lifetime of the wire displayed an opposite trend; that of a diamond wire can be classified into two regimes.

The first one is an increased loss of abrasives as a result of rapid wear attributed to a low concentration; the second regime is caused by a drop in actual contact pressure due to the enlarged contact area between the workpiece and the bonding material enveloping the abrasives.

참고문헌 (Reference)

1 N. Suh, "Trybophysics" Prentice-Hall 96-100, 1986

2 I. Kao, "Technology and research of slurry wire saw manufacturing systems in wafer slicing with free abrasive machining" 7 (7): 7-20, 2004

3 P. Pauli, "Swiss wafer slicing technology for the global PV market from meyer burger AG novel trends for the future in photovoltaic wafer manufacturing" 2005

4 M. Ataei, "Predicting the production rate of diamond wire saw using statistical analysis" 5 : 1289-1295, 2012

5 H. J. Kim, "Multiwire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires" 62 : 335-338, 2013

6 Z. Gahr, "Microstructure and wear of materials" Elsevier Science Publishers 383-385, 1987

7 추원식, "Hybrid Manufacturing in Micro/Nano Scale: A Review" 한국정밀공학회 1 (1): 75-92, 2014

8 Chunhui Chung, "Generation of Diamond Wire Sliced Wafer Surface based on the Distribution of Diamond Grits" 한국정밀공학회 15 (15): 789-796, 2014

9 J. Webster, "Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers" 19 : 597-617, 2004

10 D. Y. Kim, "Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw" 2 (2): 117-121, 2015

11 C. Chung, "Distribution of diamond grains in fixed abrasive wire sawing process" 74 : 1485-1494, 2014

12 Y. Chiba, "Development of a high speed manufacturing method for electroplated diamond wire tools" 52 (52): 281-284, 2003

13 H. J. Kim, "Characterization of cutting ability of electroplated diamond wire used for multi-wire saw" 1017 : 549-552, 2014

14 T. Liedke, "A macroscopic mechanical model of the wire sawing process" 51 : 711-720, 2011