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1 Evans,A.G, "Wear Mechanisms in Ceramics"
2 Wei,S, "Vibration Analysis of Wire and Frequency Response in the Modern Wiresaw Manufacturing Process" 231 (231): 1383-1395, 2000
3 Yoshioka,J, "Ultraprecision Grinding Technology for Brittle Materials:Application to Surface and Centerless Grinding Processes" ASME Production Engineering Division 209-227, 1985
4 Chuanzhen Huang, "Transition Mechanism from Brittle Fracture to Ductile Shear when Machining Brittle Materials with an Abrasive Waterjet" 한국정밀공학회 9 (9): 11-17, 2008
5 류래형, "Theoretical and Experimental Analysis of Material Deformation by Microcontact" 한국정밀공학회 10 (10): 111-116, 2009
6 Bhagavat,S, "Theoretical Analysis on the Effects of Crystal Anisotropy on Wiresawing Process and Application to Wafer Slicing" 46 (46): 531-541, 2006
7 Chiang,S.S, "The Response of Solids to Elastic/Plastic Indentation.II.Fracture Initiation" 53 (53): 312-317, 1982
8 Chiang,S.S, "The Response of Solids to Elastic/Plastic Indentation.I.Stresses and Residual Stresses" 53 (53): 298-311, 1982
9 Liu,B.C, "Sawing Trajectory and Mechanism of Diamond Wire Saw" 259 : 395-400, 2004
10 Meng,J.F, "Research on Endless Wire Saw Cutting of Al2O3/TiC Ceramics" 315 : 571-574, 2006
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23 Marshall,D.B, "Elastic/Plastic Indentation Damage in Ceramics:The Lateral Crack System" 65 (65): 561-566, 1982
24 Bifano,T.G, "Ductile-Regime Grinding:a New Technology for Machining Brittle Materials" 113 (113): 184-189, 1991
25 Kim,J.D, "Ductile Regime Grinding of Ferrite with Variation of Grain Size by a Piezoelectric-driven Micropositioning Grinding Table" 211 (211): 487-493, 1997
26 Ngoi,B.K.A, "Ductile Regime Finish Machining-A Review" 16 (16): 547-550, 2000
27 Cook,R.F, "Direct Observation and Analysis of Indentation Cracking in Glasses and Ceramics" 73 (73): 787-817, 1990
28 Ge,P.Q, "Development of Endless Diamond Wire Saw and Sawing Experiments" 471 : 481-484, 2004
29 Moller,H.J, "Basic Mechanisms and Models of Multi–Wire Sawing" 6 (6): 501-513, 2004
30 Wei,S, "Analysis of Stiffness Control and Vibration of Wire in Wiresaw Manufacturing Process" 813-818, 1998
31 Fu,G, "A Plasticitybased Model of Material Removal in Chemical-Mechanical Polishing(CMP)" 14 (14): 406-417, 2001