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Mechanical Scaling Trends and Methods to Improve Reliability of Packaged Interconnect Structures
Lane, M.W.; Roush, A.; Callahan, S.E. New York; Curran 2009 p.1-12
Raghothamachar, B.; Sarkar, V.; Noveski, V.; Dudley, M.; Sharan, S. New York; Curran 2009 p.13-18
Cuddalorepatta, G.; Dasgupta, A. New York; Curran 2009 p.19-24
Lin, W.; Wong, C.P. New York; Curran 2009 p.25-36
Comparison of Carbon-based Nanostructures with Commercial Products as Thermal Interface Materials
Rosshirt, M.; Fabris, D.; Cardenas, C.; Wilhite, P.; Tu, T.; Yang, C.Y. New York; Curran 2009 p.37-42
3D Thermal-Fluid and Stress Analysis for Single Chip SiC Power Sub-Modules
Tsao, B.; Sondergelt, K.; Lawson, J.; Scofield, J.; Elston, L. New York; Curran 2009 p.43-48
Superhydrophobic Silicon Surfaces with Low Light Reflectivity
Xiu, Y.; Liu, Y.; Hess, D.W.; Wong, C.P. New York; Curran 2009 p.49-58
Integrated Capacitors with Nb~2O~5 Dielectric for Decoupling Applications
Jacob, S.; Schaper, L.W.; Benamara, M. New York; Curran 2009 p.59-64
Influence of Nodulizer Type on the Quality of Solder Ball
Guo, X.; Yan, Y.; Zhang, W.; Feng, L.; Wang, M. New York; Curran 2009 p.65-70
Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages
Karmarkar, A.; Zhai, C.; Xu, X.; Lin, X.; Rollins, G.; Moroz, V. New York; Curran 2009 p.71-76