Synthesis of ceramic coating on copper microspheres for thermal management of electronics = Synthesis of ceramic coating on copper microspheres for thermal management of electronics

다국어 초록 (Multilingual Abstract)

As the advanced electronic technologies rapidly emerge, the need for efficient thermal management of such units becomes of major significance. Currently, most of the epoxy adhesives used in such systems are reinforced with metal and/or other conductive particles. Despite their desirably high thermal conductivity, use of such materials increase the risk of unwanted electrical flows within the chip, which may result in explosion and destruction of the whole unit. To address this issue in the present study, copper (Cu) microspheres were chemically coated with a thin ceramic layer which possesses a much higher electrical resistance compared with pristine metal. Silicon nitride (SiN) and aluminum nitride (AlN) were synthesized on copper by the means of chemical dipping and post-heat treatment.