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https://www.riss.kr/link?id=O39765366
1996년
eng
학술저널
INTERNATIONAL CHEMICAL MECHANICAL POLISH FOR VLSI ULSI MULTILEVEL INTERCONNECTION CONFERENCE
107-111 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
Chemical-mechanical polish (CMP) for VLSI/ULSI multilevel interconnection conference
1st
Santa Clara; CA
1996; Feb
0
상세조회0
다운로드
An Overview of Current Issues and Future Trends in CMP Consumables
An Improved Polish Pad Conditioner for CMP
Polishing Properties of Tungsten Slurries - A Comparison of Available Products
Pad Degradation and Conditioning Studies for CMP of Interlayer Dielectric Films