A Study of the LED Module Heat Dissipation Structure Suitable

다국어 초록 (Multilingual Abstract)

In this paper, reduces the absolute temperature of the LED module, results of the experiments have been derived a method to improve the suitability heat dissipation structure and properties are as follows. First, FR-4 PCB size in consideration of the PCB LED module air-hole 3mm radius of the LED module area 10%, 20%, 30% ratio after a process of simulation to generate the air-hole on the PCB and the surrounding, 30%, 50×30mm intervals, when generating a fifty-two, applying the air-hole 3mm 10% of the radius of the area LED module obtained the results of temperature reduction than max. about 3.5℃ and min. about 3.1℃. Second, LED array interval and to be suitable experimental structure through the PCB air-hole generation plate type heat-sink for LED module to support the air-hole radius 40mm size to create a two and six and four, as a result of the simulation in progress, when air-hole number pairs of the increase, max. and min. temperature was reduced to obtain a formal conclusion by about 1~1.5℃. the air-hole 3mm 10% of the radius of the area applied LED module than max. about 4.5℃, min. about 4.2℃ results was confirmed reduction. As a result, to the suitable of the heat dissipation even if the LED module PCB material no matter how good, if the heat sink is not well designed structural cannot obtain a large effect.

목차 (Table of Contents)

• Abstract
• 1. Introduction
• 2. Theory
• 2.1 Thermal Design Process
• 2.2 PCB Air-Hole Apply Comparative Experiments
• 2.3 Heat-Sink Air-Hole Apply Comparison Test
• 2.4 Thermal Design Experimental Analysis
• 3. Conclusion
• Acknowledgements
• References