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https://www.riss.kr/link?id=O46741898
2005년
eng
학술저널
INTERNATIONAL CONFERENCE ON THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS
2 [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0780390628; 0780390636
EuroSimE 2005 Conference; Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Berlin, Germany
2005; Apr
0
상세조회0
다운로드
Nanoreliability - Combined Simulation and Experiment
Trends in Power Semiconductor Packaging
Sense and Nonsense of Heat Transfer Correlations Applied to Electronic Cooling
Importance of Upstream Design in Product Development and Its Methodology