1 F. T. Wallenberger, 21 : 28-, 2001
2 Y. L. Cheng, 114 : 12-, 2014
3 J. J. Liu, 81 : 4180-, 2002
4 R. R. Tummala, 74 : 895-, 1991
5 J. S. Lee and, 23 : 44-, 2013
6 J. S. Lee and, 23 : 180-, 2013
7 F. T. Wallenberger, "Fiberglass and Glass Technology Energy-Friendly Compositions and Applications" Springer 188-190, 2010
8 R. E. Hummel, "Electronic Properties of Materials" Springer 206-, 2001
9 R. E. Hummel, "Electronic Properties of Materials" Springer 203-, 2001
10 M. L. Minges, "Electronic Materials Handbook:packaging, 1"
1 F. T. Wallenberger, 21 : 28-, 2001
2 Y. L. Cheng, 114 : 12-, 2014
3 J. J. Liu, 81 : 4180-, 2002
4 R. R. Tummala, 74 : 895-, 1991
5 J. S. Lee and, 23 : 44-, 2013
6 J. S. Lee and, 23 : 180-, 2013
7 F. T. Wallenberger, "Fiberglass and Glass Technology Energy-Friendly Compositions and Applications" Springer 188-190, 2010
8 R. E. Hummel, "Electronic Properties of Materials" Springer 206-, 2001
9 R. E. Hummel, "Electronic Properties of Materials" Springer 203-, 2001
10 M. L. Minges, "Electronic Materials Handbook:packaging, 1"
11 M. L. Minges, "Electronic Materials Handbook:packaging, 1"
12 F. T. Wallenberger, "Advanced Inorganic Fibers : Process, Structures, Properties, Applications" 149-, 2000